Wafer back grinding equipment is becoming more and more automated, which is likely to assist in obtaining higher degree of quality and lowering wafer thicknesses to even lesser than 0.050 mm. In order to attain such ultra-thin thicknesses, it is essential to make use of a diamond grit-grinding wheel. As a result, the thicknesses of all background targets are using ultra-fine grind whe... https://www.transparencymarketresearch.com/thin-wafer-processing-dicing-equipment-market.html