Electronic Component Packaging is evolving with Panel-Level Packaging (PLP), which enhances the protection and performance of sensitive components. By using larger substrates and more efficient manufacturing processes, PLP reduces costs and increases reliability. This innovation is key to improving the durability and longevity of electronic devices across industries. https://www.pack... https://www.packaging-labelling.com/articles/panel-level-packaging-the-next-frontier-for-electronics-protection